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An international team developed a novelty technology. They transplanted high-performance magnetic memory chips onto a flexible plastic surface without damaging their performance. The resulting transparent film-like flexible “smart plastic†chips have excellent data storage and processing capabilities. It has become a key component in the design and development of flexible lightweight equipment.
According to the Daily Scientific News report on the 19th, in the latest study, scientists first planted a magnesium oxide-based magnetic tunnel junction (MTJ) on a silicon surface, then etched away the underlying silicon, and then used a transfer method in a Polyethylene terephthalate made of flexible plastic surface, implanted with a magnetic memory chip.
The operation of the new device on magnetoresistive random access memory (MRAM) shows that MRAM performance is in many ways stronger than traditional random access memory computer chips, such as higher processing speed, lower power consumption, and power failure After storing data and so on.
Flexible electronic devices are especially attractive for flexible magnetic storage devices because they are key components for data storage and processing in wearable electronics and biomedical devices. Although scientists have conducted many studies on different memory chips and materials, constructing high-performance memory chips on flexible bases without compromising their performance still faces enormous challenges. To this end, Yang Xianxiu, an associate professor at the National University of Singapore, led scientists from Yonsei University in South Korea, the University of Ghent in Belgium, and the Institute of Materials Research and Engineering in Singapore to develop this new technology.
Yang Xianxiu said: “We are the first team to construct a magnetic memory on a flexible surface. Experiments have shown that the tunnel magnetoresistance of new equipment can reach 300%. At the same time, we also managed to improve the control of the switch, so that this flexible magnetic The chip can transfer data faster."
The team recently applied for a patent for this technology in the United States and South Korea. They are further increasing the reluctance of the device and plan to apply it to other electronic devices.
Related research was published in the latest issue of Advanced Materials magazine. (Reporter Liu Xia)
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