Surface modification technology cutting tool (coated carbide cutting tools and coated high speed steel) surface coating technology in recent decades should <br> <br> market demand developed. The coating technology can effectively extend the service life of the cutting tool and give the tool excellent overall mechanical properties, thus greatly improving the machining efficiency. For this reason, coating technology together with cutting materials and cutting processes is called the three key technologies in the field of cutting tool manufacturing.
Cutting tool coating refers to coating a surface of a mechanical cutting tool with a layer of high hardness and wear resistance. In order to meet the requirements of high efficiency, high precision and high reliability of modern machining, the manufacturing industry in the world has paid more and more attention to the development of coating technology and its application in tool manufacturing. In the factories of industrialized countries, the coating was implemented. The layer of the tool in the overall proportion of nearly 60%.
At present, the coating technology methods mainly include a vapor deposition method, a sol-gel method, a thermal spray method, and the like. Among them, the vapor deposition method has many applications, and the quality of the prepared coating is high. Vapor deposition techniques are generally classified into physical vapor deposition (PVD) and chemical vapor deposition (CVD).
The methods for preparing the surface coating of cutting tools by vapor deposition mainly include the following: magnetron sputtering deposition coating, arc ion plating deposition coating, high temperature chemical vapor deposition coating, medium temperature chemical vapor deposition coating, plasma enhanced chemistry Vapor deposited coating. The most commonly used ones are high temperature chemical vapor deposition, magnetron sputtering deposition and arc ion plating. The advantages and disadvantages of various coating technologies are described below.
<br> <br> magnetron sputtering magnetron sputter depositing a coating (magnetronsputtering) glow discharge technology is visible, be coated using the principle of cathode sputtering. The film particles are derived from the cathodic sputtering effect of argon ions on the cathode target in the glow discharge. After the argon ions sputter the target atoms, they are deposited on the workpiece to form the desired film layer. Since a magnetic field is introduced in the target portion of the sputtering apparatus, the magnetic lines of force constrain the electrons near the surface of the target, prolonging its trajectory in the plasma, thereby increasing its degree of participation in gas molecule collision and ionization processes.
Magnetron sputtering deposition has the following advantages:
(1) The deposition rate is high and the target voltage required for sustain discharge is low;
(2) The bombardment energy of electrons to the substrate is small;
(3) The structure of the film layer is fine. Since the magnetron sputtering deposition coating is an atomic state particle obtained by cathode sputtering, it carries the higher energy obtained from the target surface and reaches the workpiece, which is favorable for forming a fine core and growing into a very fine particle. Membrane layer structure;
(4) The magnetron sputtering deposition coating can obtain a large-area film and can be widely used.
But this method also has the following problems:
(1) The target etching is uneven. Due to the uneven distribution of the magnetic field strength, the utilization of the target is low. This can improve the target magnetic field strength by rationally designing the target structure and adding an electromagnetic field to realize the discharge scanning, thereby effectively improving the target utilization rate.
(2) The metal ionization rate is low. In response to this, the magnet volume of the target center can be increased (or reduced) as required, causing some magnetic lines of force to diverge to the vicinity of the substrate farther from the target, thereby achieving unbalanced magnetron sputtering.
It is worth mentioning that the magnetron sputtering method can also be used to prepare multilayer films and nano films. With the rapid development of high-tech and emerging processing industries, the demand for deposition of multilayer films and nano-films with higher performance is increasing. increase. Therefore, the magnetron sputtering technology deserves further in-depth research and development, and its application prospect is superior.
Arc ion plating deposition techniques <br> <br> ion plating (ionplating, IP) is a new technique based on vacuum evaporation plating on the developed, it is introduced a variety of ways gas discharge vapor deposition art, so that the entire vapor deposition process is It is carried out in a plasma. (
Cutting tool coating refers to coating a surface of a mechanical cutting tool with a layer of high hardness and wear resistance. In order to meet the requirements of high efficiency, high precision and high reliability of modern machining, the manufacturing industry in the world has paid more and more attention to the development of coating technology and its application in tool manufacturing. In the factories of industrialized countries, the coating was implemented. The layer of the tool in the overall proportion of nearly 60%.
At present, the coating technology methods mainly include a vapor deposition method, a sol-gel method, a thermal spray method, and the like. Among them, the vapor deposition method has many applications, and the quality of the prepared coating is high. Vapor deposition techniques are generally classified into physical vapor deposition (PVD) and chemical vapor deposition (CVD).
The methods for preparing the surface coating of cutting tools by vapor deposition mainly include the following: magnetron sputtering deposition coating, arc ion plating deposition coating, high temperature chemical vapor deposition coating, medium temperature chemical vapor deposition coating, plasma enhanced chemistry Vapor deposited coating. The most commonly used ones are high temperature chemical vapor deposition, magnetron sputtering deposition and arc ion plating. The advantages and disadvantages of various coating technologies are described below.
<br> <br> magnetron sputtering magnetron sputter depositing a coating (magnetronsputtering) glow discharge technology is visible, be coated using the principle of cathode sputtering. The film particles are derived from the cathodic sputtering effect of argon ions on the cathode target in the glow discharge. After the argon ions sputter the target atoms, they are deposited on the workpiece to form the desired film layer. Since a magnetic field is introduced in the target portion of the sputtering apparatus, the magnetic lines of force constrain the electrons near the surface of the target, prolonging its trajectory in the plasma, thereby increasing its degree of participation in gas molecule collision and ionization processes.
Magnetron sputtering deposition has the following advantages:
(1) The deposition rate is high and the target voltage required for sustain discharge is low;
(2) The bombardment energy of electrons to the substrate is small;
(3) The structure of the film layer is fine. Since the magnetron sputtering deposition coating is an atomic state particle obtained by cathode sputtering, it carries the higher energy obtained from the target surface and reaches the workpiece, which is favorable for forming a fine core and growing into a very fine particle. Membrane layer structure;
(4) The magnetron sputtering deposition coating can obtain a large-area film and can be widely used.
But this method also has the following problems:
(1) The target etching is uneven. Due to the uneven distribution of the magnetic field strength, the utilization of the target is low. This can improve the target magnetic field strength by rationally designing the target structure and adding an electromagnetic field to realize the discharge scanning, thereby effectively improving the target utilization rate.
(2) The metal ionization rate is low. In response to this, the magnet volume of the target center can be increased (or reduced) as required, causing some magnetic lines of force to diverge to the vicinity of the substrate farther from the target, thereby achieving unbalanced magnetron sputtering.
It is worth mentioning that the magnetron sputtering method can also be used to prepare multilayer films and nano films. With the rapid development of high-tech and emerging processing industries, the demand for deposition of multilayer films and nano-films with higher performance is increasing. increase. Therefore, the magnetron sputtering technology deserves further in-depth research and development, and its application prospect is superior.
Arc ion plating deposition techniques <br> <br> ion plating (ionplating, IP) is a new technique based on vacuum evaporation plating on the developed, it is introduced a variety of ways gas discharge vapor deposition art, so that the entire vapor deposition process is It is carried out in a plasma. (
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