Dual interface card is made of PVC laminated chip coil, based on a single chip, set contactless and non-contact interface as one of the smart card, it has two operating interfaces, access to the chip, can be contact by way of contact It is also possible to access the chip by radio frequency through a certain distance. There is only one chip on the card, two interfaces, the same operation can be performed through the contact interface and the non-contact interface. The two interfaces follow two different standards, the contact interface conforms to ISO/IEC 7816, and the non-contact conforms to ISO/IEC 14443.
Dual interface card composition
Dual-interface card/CPU card (Time COS/DI) is a single-chip, smart card with integrated contact and contactless interfaces. Both interfaces share the same microprocessor, operating system, and EEPROM. The card includes a microprocessor chip and an antenna coil connected to the microprocessor. The electromagnetic field generated by the reader provides energy, and the energy supply and data transmission are achieved through radio frequency.
Product model: There are two types of Time COS/DI card:
One is based on Philips' Mifare PRO-MF2ICD80 dual-interface chip. The contact part meets the requirements of ISO7816 and "Financial Integrated Circuit IC Card Specification" in China. The non-contact part conforms to the TYPEA standard in the ISO14443 specification.
One is the upcoming Siemens-based SLE66CLXX series of dual-interface chip development, the contact part is in line with ISO7816 and "Chinese financial integrated circuit IC card specification", non-contact part supports ISO14443-TYPEA or TYPEB dual interface card.
Card capacity is 8KBYTE, 16KBYTE optional.
Advantages of Dual Interface Cards: One Card, One Card, One Card
Cards support multiple applications: A single card can integrate multiple applications, multiple industries, and multiple applications. The application is flexible and convenient. According to different application conditions and requirements, contact or non-contact trading methods can be optionally used to reduce operating costs. It is applicable to trial environments where the transaction volume is large, the transaction time is short, and the transaction process does not need to wait; the machine is fully closed. Applicable to harsh working environment and self-service consumption place, strong against damage and anti-interference ability; applicable to systems with high security requirements, can be used as a financial electronic wallet; card anti-collision mechanism, allowing multiple cards to enter the trading area at the same time; fully compatible with conventional contact-type devices, may be used directly in a highly secure <br> <br> thereon
Chip security: The chip with a random data generator inside can prevent various physical and logical attacks; the program code COS in the chip cannot be reproduced once it is written; each chip has a unique factory code. Operating system security: Single DES and Triple DES algorithms are supported: Single DES or Triple DES algorithms can be automatically selected according to the key length; line encryption and protection functions are supported to prevent communication data from being illegally stolen or tampered; and various key types support key encryption. Different ways of use. Transmission security: Data transmission in a non-contact manner follows the relevant transmission protocol. After the encryption processing of cards and implements, the data will not be leaked even if it is intercepted.
Fast Trading
The chip contains a DES operation accelerator, which can quickly complete the Single DES, Triple DES and other algorithms, a Triple DES operation time of 130 microseconds; non-contact communication, communication transmission rate of 106KBPS; contact part of the communication rate can be adjusted, the communication rate can be Reach 38400bps.
Good compatibility
Conforms to the requirements of the "Financial Integrated Circuit (IC) Card Specification of China"; conforms to Type A in the ISO14443 standard; later Siemens-based dual interface cards support TypeA or TypeB. Currently used Mifare-I card readers can read and write tools, and they can easily read and write Mifare-Pro type Time COS/DI that support TypeA.
Dual interface CPU card packaging process description
The dual-interface CPU card, as a new technology, has its own special requirements for card packaging. There are two main types of packaging processes currently used: lamination and injection molding. Compared with ordinary contact cards, dual interface cards increase a set of antennas and also increase the difficulty of the card packaging process. At present, there are certain problems in using the dual interface card packaging technology: the antenna is a non-contact chip and read/write device. Between the media for energy transfer and communication, generally in the package, the contacts between the antenna and the chip are connected by conductive rubber. Due to the problems of the process and the conductive rubber, the connection between the antenna of some cards and the contacts is unstable, and often Double interface card will appear after the package is completed or used for a period of time, the non-contact interface can not work normally. In the application test, due to the packaging problem, the proportion of the card non-contact interface can not work normally accounts for the vast majority of the card failure rate. In the dual-interface card package, the company uses a unique packaging process that solves the problem of connection between the antenna and the contacts of the dual interface card, and makes the connection between the antenna and the contact more solid and reliable; due to this technology For applications, the packaging yield of dual interface cards and the failure of non-contact interfaces during use have been greatly reduced.
There are three types of dual interface cards:
1. The contact smart card system and the contactless smart card system are only physically combined into one card and two EEPROMs. The two systems are independent of each other.
2. The contact smart card system and the contactless smart card system operate independently of each other, but share part of the memory space in the card.
3. The contact smart card system and the contactless smart card system are completely integrated, and the contact and non-contact operation states are the same, sharing one CPU management. Of the three dual-interface IC cards, only the last dual-interface IC card is a true non-contact dual-interface CPU card.
Dual interface card composition
Dual-interface card/CPU card (Time COS/DI) is a single-chip, smart card with integrated contact and contactless interfaces. Both interfaces share the same microprocessor, operating system, and EEPROM. The card includes a microprocessor chip and an antenna coil connected to the microprocessor. The electromagnetic field generated by the reader provides energy, and the energy supply and data transmission are achieved through radio frequency.
Product model: There are two types of Time COS/DI card:
One is based on Philips' Mifare PRO-MF2ICD80 dual-interface chip. The contact part meets the requirements of ISO7816 and "Financial Integrated Circuit IC Card Specification" in China. The non-contact part conforms to the TYPEA standard in the ISO14443 specification.
One is the upcoming Siemens-based SLE66CLXX series of dual-interface chip development, the contact part is in line with ISO7816 and "Chinese financial integrated circuit IC card specification", non-contact part supports ISO14443-TYPEA or TYPEB dual interface card.
Card capacity is 8KBYTE, 16KBYTE optional.
Advantages of Dual Interface Cards: One Card, One Card, One Card
Cards support multiple applications: A single card can integrate multiple applications, multiple industries, and multiple applications. The application is flexible and convenient. According to different application conditions and requirements, contact or non-contact trading methods can be optionally used to reduce operating costs. It is applicable to trial environments where the transaction volume is large, the transaction time is short, and the transaction process does not need to wait; the machine is fully closed. Applicable to harsh working environment and self-service consumption place, strong against damage and anti-interference ability; applicable to systems with high security requirements, can be used as a financial electronic wallet; card anti-collision mechanism, allowing multiple cards to enter the trading area at the same time; fully compatible with conventional contact-type devices, may be used directly in a highly secure <br> <br> thereon
Chip security: The chip with a random data generator inside can prevent various physical and logical attacks; the program code COS in the chip cannot be reproduced once it is written; each chip has a unique factory code. Operating system security: Single DES and Triple DES algorithms are supported: Single DES or Triple DES algorithms can be automatically selected according to the key length; line encryption and protection functions are supported to prevent communication data from being illegally stolen or tampered; and various key types support key encryption. Different ways of use. Transmission security: Data transmission in a non-contact manner follows the relevant transmission protocol. After the encryption processing of cards and implements, the data will not be leaked even if it is intercepted.
Fast Trading
The chip contains a DES operation accelerator, which can quickly complete the Single DES, Triple DES and other algorithms, a Triple DES operation time of 130 microseconds; non-contact communication, communication transmission rate of 106KBPS; contact part of the communication rate can be adjusted, the communication rate can be Reach 38400bps.
Good compatibility
Conforms to the requirements of the "Financial Integrated Circuit (IC) Card Specification of China"; conforms to Type A in the ISO14443 standard; later Siemens-based dual interface cards support TypeA or TypeB. Currently used Mifare-I card readers can read and write tools, and they can easily read and write Mifare-Pro type Time COS/DI that support TypeA.
Dual interface CPU card packaging process description
The dual-interface CPU card, as a new technology, has its own special requirements for card packaging. There are two main types of packaging processes currently used: lamination and injection molding. Compared with ordinary contact cards, dual interface cards increase a set of antennas and also increase the difficulty of the card packaging process. At present, there are certain problems in using the dual interface card packaging technology: the antenna is a non-contact chip and read/write device. Between the media for energy transfer and communication, generally in the package, the contacts between the antenna and the chip are connected by conductive rubber. Due to the problems of the process and the conductive rubber, the connection between the antenna of some cards and the contacts is unstable, and often Double interface card will appear after the package is completed or used for a period of time, the non-contact interface can not work normally. In the application test, due to the packaging problem, the proportion of the card non-contact interface can not work normally accounts for the vast majority of the card failure rate. In the dual-interface card package, the company uses a unique packaging process that solves the problem of connection between the antenna and the contacts of the dual interface card, and makes the connection between the antenna and the contact more solid and reliable; due to this technology For applications, the packaging yield of dual interface cards and the failure of non-contact interfaces during use have been greatly reduced.
There are three types of dual interface cards:
1. The contact smart card system and the contactless smart card system are only physically combined into one card and two EEPROMs. The two systems are independent of each other.
2. The contact smart card system and the contactless smart card system operate independently of each other, but share part of the memory space in the card.
3. The contact smart card system and the contactless smart card system are completely integrated, and the contact and non-contact operation states are the same, sharing one CPU management. Of the three dual-interface IC cards, only the last dual-interface IC card is a true non-contact dual-interface CPU card.
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